PESU: Polyethersulfone

General Properties

Short Name:

Name: 

PESU

Polyethersulfone


Polyethersulfone (PESU) is an amorphous, aromatic high-temperature polymer and belongs to the group of polysulfones; it is, however, superior to pure polysulfone with respect to chemical resistance and impact strength.

Structural Formula


Properties

Glass Transition Temperature225 to 230°C
Melting Temperature-
Melting Enthalpy-
Decomposition Temperature580 to 595°C
Young's Modulus2600 to 2800 MPa
Coefficient of Linear Thermal Expansion60 *10-6/K
Specific Heat Capacity1.37 J/(g*K)
Thermal Conductivity0.18 W/(m*K)
Density1.37 g/cm³
MorphologyAmorphous material
General propertiesHigh stability, stiffness and hardness. High deformation resistance. Very good heat and OxidationOxidation kann im Zusammenhang mit thermischer Analyse verschiedene Vorgänge bezeichnen.oxidation resistance. Good electrical insulation properties. Hydrolysis-resistant to aqueous and alkaline media
ProcessingExtrusion, injection molding
ApplicationsInstrument and apparatus engineering. Automobile and aircraft industry. Electrical and electronical components. Medical engineering. Photo equipment

NETZSCH Measurement

InstrumentDSC 204 F1 Phoenix®
Sample Mass12.66 mg
Isothermal Phase5 min
Heating/Colling Rates10 K/min
CrucibleAl, pierced lid
AtmosphereN2 (40 ml/min)

Evaluation

The glass transition of the amorphous PESU occurred at 228°C (midpoint) with a step height of 0.23 J/(g*K) and 0.24 J/(g*K) in the 1st (blue) and 2nd heating (red), respectively. In the DSC curve of the 2nd heating, the glass transition step is overlapped by a small RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation peak, indicating the presence of ordered regions within the amorphous matrix that formed during the controlled cooling at 10 K/min.