Messe Frankfurt

NETZSCH @ Formnext

Shenzhen World Exhibition & Convention Center, China

Characterization tools to support your research and production

NETZSCH Analyzing and Testing offers a huge variety of analysis equipment to select the best material for your application, optimize your AM processes or improve the performance of your parts. At the Formnext show in Frankfurt, the leading industry platform for AM, we will be available to answer your questions.

Chat with our experts to learn

  • how the process window of SLS powder can be determined with the help of Differential Scanning Calorimetry,
  • how the flow behavior of filaments can be studied with rheology or
  • how the thermal diffusivity of metals can be measured over a wide temperature range using Light Flash Analysis.

Visit our joint booth with Malvern Panalytical in Hall 11, Booth D26!

Thermal Analysis and Kriechen (Rheologie)Creep is one of the earliest “controlled stress” rheometer tests that quite literally “creeps” the material, i.e. we measure over a relatively prolonged period the small movement (the creep defined as creep compliance, J) of the sample by applying a small constant stress.Rheology can help you with your research questions and production solutions. Check out our DSC 300 Caliris® and Kinexus rheometer on display or browse a selection of instruments relevant to the Additive Manufacturing industry here:

You are interested and want to learn more about the use of Thermal Analysis and Rheology in AM?

We have a whole video series dedicated to Material Science in Additive Manufacturing; starting from the basics of processing all the way to the characterization and optimization using our analysis tools. Watch the series week by week, or access the entire series.