Analyse Thermo-Mécanique

TMA 402 F3 Hyperion® Polymer Edition

Thermomechanical Analysis – TMA - Tailor-Made for Low-Temperature Applications 

TMA Analysis for Polymers

Polymers undergo changes in their thermomechanical properties during heating and cooling. TMA analyses can give insights into molecular orientation and quenching effects during cooling. It allows the design of adhesives and other hybrid joints and quality control of shrink films. TMA analyses can hereby provide valuable insight into the composition, structure, production conditions or application possibilities for various materials.

Determination of Viscoelastic Properties like Relaxation, Creep and Stress/Strain

The TMA 402 F3 Hyperion® Polymer Edition now offers not only to keep the force constant and to measure the length change, but also to change the displacement and measure the corresponding force. This is for example used in a ContrainteLa Contrainte est définie par un niveau de force appliquée sur un échantillon d’une section bien définie. (Contrainte = force/surface). Les échantillons qui possèdent une section rectangulaire ou circulaire peuvent être comprimés ou étirés. Les matériaux élastiques comme les élastomères peuvent être étirés jusqu’à 5 à 10 fois leur longueur initiale.stress RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation test. Here, a sample is stretched by a specific amount at a defined temperature. During the test, the deformation is kept constant and the progression of the force is recorded. This force continuously decreases as a result of material RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation. Stress-RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation is ultimately defined by the residual stress measured after a defined exposure period. The data can be depicted graphically in a stress-time diagram. It is then possible to read off both the stress-RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation behavior and the values for the RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation rate and time.

Mechanical Cooling to -70°C

The TMA 402 F3 Hyperion® Polymer Edition is specifically designed for polymer applications. It comes with a compact, highly reactive furnace capable of covering a temperature range  from -70°C to 450°C using a mechanical cooling system without the need for LN₂.

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Technical Data

IC Furnace
-70°C to 450°C using mechanical cooling
Heating rates
0.001 K/min to 30 K/min
Measuring ranges/
Δl resolution
500 μm / 0.125 nm
5000 μm (± 2500 μm) / 1.25 nm

Displacement Control
Displacement static, steps, ramps

Force range (load at sample)
0.001 N to 3 N without using additional weights

Force resolution
< 0.01 mN

Interchangeable sample holder systems
Fused silica, up to 450°C

Sample dimensions
Expansion/penetration: length: 30 mm max.; sample holder Ø 8 mm
Tension: length: 30 mm max.; width: 6 mm; thickness: 1 mm
3-Point bending: length: 10 mm max.; width: 5 mm

Automatic sample length determination (precision: 0.01 mm)

Atmospheres
1 mass flow controller (MFC, 2nd independent MFC optional), gas flow rate 0 to 250 ml/min software-controlled, inert, oxidizing, reducing, vacuum (10-4 mbar)

Various accessories
Spacers, crucibles and special wax containers

Littérature d'application

Product Information

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