セミナー
18.05.2023 15:30 – 21:30
Dearborn, MI USA
How to Optimize Your Polymer Workflow with Thermal Analysis and Rheology
Registration is closed, we're at capacity.
Attendees will be introduced to the basic techniques of thermal analysis and rheology, including but not limited to DSC, TGA, STA, LFA, rotational and capillary techniques. An overview of the theory will be given, followed by instrumentation basics as well as how instrument configuration can impact results. Finally, real world application examples will be discussed for each characterization technique. There will be ample time for attendees to discuss their applications with our experts.
- Detailed Schedule is below
Registration is closed, we're at capacity. Please email us for questions:
Location
Doubletree Hotel
Dearborn, MI
5801 Southfield Fwy
Detroit, MI 48228
Phone: (313) 336-3340
Date and time
18 May 2023
9 AM - 3:30PM
Registration
Registration is closed, we're at capacity.
AGENDA
How to Optimize Your Polymer Workflow with Thermal Analysis and Rheology
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Thursday, May 18 , 2023 | ||
| 8:45 am - 9:15 am | Arrival and Continental Breakfast | |
| 9:15 am - 9:30 am | Welcome and Introduction to NETZSCH | Dr. Natalie Rudolph, Peter Vichos |
| 9:30 am - 10:30 am | Quality Control and Failure Analysis by DSC (Differential Scanning Calorimetry) | |
| 10:30 am -10:45 am | ***BREAK*** | |
| 10:45 am -12:00 am | Plastics in the Flow by Rotational and Capillary Rheology | Dr. Natalie Rudolph |
| 12:00 am-12:30 pm | Compositional Analysis of Compounds by TGA (Thermogravimetric Analysis) - An Overview | |
| 12:30 pm -1:45 pm | ***LUNCH*** | |
| 1:45 pm - 2:15 pm | Characterization of the Viscos-elastic Properties of Polymers by DMA (Dynamic Mechanical Analysis) | Dr. Natalie Rudolph |
| 2:15 pm - 3:00 pm | Cure Monitoring of Thermosetting Resins by DEA (Dielectric Analysis) | Dr. Natalie Rudolph |
| 3:00 pm | Wrap-up and Discussion | Peter Vichos |
* Participants receive a USB drive containing all Presentation Material and Product Literature |
„Whether you are a complete beginner, or an expert planning to bring your most challenging application questions, we look forward to seeing you there“