Cure Monitoring by Means of Dielectric Analysis (DEA) | Part 1: Measuring Principle

Cure monitoring is essential in the processing of thermosets, adhesives, composites, coatings and inks. Dielectric analysis is particularly well suited to these applications as it allows not only laboratory-based measurements but also real-time in-process monitoring. This means that the curing reaction can be followed as it happens, providing valuable insight into reaction progress and material behaviour throughout the cure cycle.

Dielectric analysis is a powerful tool for monitoring cure levels, analysing cure kinetics and optimising process conditions.

In the first part of our two-part webinar series, we'll focus on the basic principles and measurement techniques behind dielectric analysis.

The second part, scheduled for June, will highlight practical application examples from real processes. Stay tuned to our homepage for the latest news!

Presenter:
Claire Strasser
Application Scientist
NETZSCH Analyzing & Testing