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제품 소개
시차 주사 열량분석 / 시차 주사 열분석 (DSC/DTA)
열중량-열량 동시 측정장비 (STA/TG-DSC)
열중량 분석기 (TGA/TG)
열팽창계수 측정장비(DIL)
열기계적 분석 – Thermomechanical Analysis (TMA)
동적기계열분석기 (DMA)
Multiple Module Calorimeter (MMC)
가속 속도 열량계
Dielectric Analyzer (DEA)
열확산도 및 열전도도 분석
Time Domain Thermoreflectance Analyzer (TDRA)
Seebeck Analyzer (SBA)
가스 분석 / 연결 (EGA)
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Heat Flow Meter (HFM) / Guarded Hot Plate/Pipe (GHP) / HotBox Test Chambers (TDW)
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제품 소개시차 주사 열량분석 / 시차 주사 열분석 (DSC/DTA)열중량-열량 동시 측정장비 (STA/TG-DSC)열중량 분석기 (TGA/TG)열팽창계수 측정장비(DIL)열기계적 분석 – Thermomechanical Analysis (TMA)동적기계열분석기 (DMA)Multiple Module Calorimeter (MMC)가속 속도 열량계Dielectric Analyzer (DEA)열확산도 및 열전도도 분석Time Domain Thermoreflectance Analyzer (TDRA)Seebeck Analyzer (SBA)가스 분석 / 연결 (EGA)소프트웨어유변학Heat Flow Meter (HFM) / Guarded Hot Plate/Pipe (GHP) / HotBox Test Chambers (TDW)Fire Testing Systems내화물 측정
재료 / 응용분야접착 레진과 밀폐제배터리바이오 연료Building Materials세라믹 / 유리무기물금속 / 합금유기물Pharma광전Polymers단열재료열전재료
Training & Know-howNETZSCH AcademyLiterature & Digital MediaGlossaryTraining & Seminars
Contract TestingMethodsGlossary유상 응용 측정 서비스
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서비스 & 지원
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유지보수 서비스
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White Paper

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  • A Basic Introduction to Rheology
  • Absolute Thermal Conductivity Measurements: 7 Things That Make for a Goof GHP
  • Absolute Wärmeleitfähigkeitsmessung - 7 Dinge, die eine gute GHP ausmachen
  • Analytical Characterization of Mouthfeel in Chocolate
  • Battery Cycling
  • Characterizing High-Modulus Composites
  • Curing of Thermosetting Resins for Fiber-Reinforced Parts
  • Die 360°-Komplettlösung von NETZSCH
  • How Can the Thermal Conductivity of Vacuum Insulation Panels Best Be Determined, Considering That There is No Reference Material Available for Such Low Thermal Conductivities?
  • Identify
  • Identify for DSC, TGA, DIL, TMA and cp Data
  • Powerful Database allows for Polymer Identification by means of DSC with a single click
  • Qualifying the New NETZSCH EPS Standard Material for HFM Instruments: A Question of Reproducibility
  • Sicherheitsuntersuchungen an Akkumulatoren
  • Superiority of Convacus Pans
  • The NETZSCH 360° View
  • Thermal Conductivity of Insulating Materials by Means of HFM Measurements
  • Understanding Yield Stress Measurements
  • UV Cure Monitoring of Paints and Adhesives
  • WP_Identify fuer DSC TG DIL TMA und cp Daten_D_0217.pdf
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