DEA 固化监测原理及树脂复材领域应用 (DEA Cure Monitoring Principle and Its Applications in Resin and Composite Materials)

树脂固化监测仪DEA是一种利用树脂和相关复材在固化工艺过程中的电阻率的变化，使用贴片式传感器对该变化进行实时监测，来跟踪树脂的流动化与固化进程，该技术具有实时在线、应用灵活、贴近工艺实际等优点，不仅能用于实验室的工艺研发、原料质检，也能用于生产车间的在线工艺监控，可帮助评估与优化固化工艺，或进行批次间的固化特性比较。

本次讲座首先对DEA的测试原理、从原始离子粘度到固化度曲线的分析方法进行了介绍，随后介绍了其在树脂的热固化、和复材热压固化领域的应用，并对该方法与DSC、旋转流变仪的应用特点和适用场景做了详细的对比。

Dielectric analysis (DEA) is a technique that uses patch-type sensors to monitor changes in the electrical resistivity of resins and related composite materials during the curing process in real time. This allows resin flow and cure progression to be tracked. The advantages of this technology include real-time online monitoring, flexible application and close alignment with actual processing conditions. DEA can be used for process development and raw material quality control in the laboratory, as well as for online process monitoring on the production floor. It helps to evaluate and optimise curing cycles and compare batch-to-batch curing characteristics.

This webinar first introduces the measurement principles of DEA and the analytical methods for converting raw viscosity data into curing-degree curves. It then presents DEA's applications in the thermal curing of resins and hot-press curing of composite materials. Finally, it makes a detailed comparison between DEA and other techniques, such as DSC and rotational rheometry, highlighting their respective application characteristics and suitable scenarios.

Speaker:
Mr. Liang Xu
Senior Application Scientist
NETZSCH Scientific Instruments (Shanghai) Ltd.
NETZSCH Analyzing & Testing