At NETZSCH, we know that time is precious. Especially in our fast moving world where we are constantly confronted with innovations, we know how important it is to make the most of our customers' precious time.
That is why we've developed a new format to present the benefits of our latest technological highlights as concisely as possible: NETZSCH TECH TALK is a compact and free of charge 30-Minute Talk on the latest technological advancements in Thermal Analysis.
When: December 5, 2023 at 9:00 am and 5:00 pm (Central European Time)
Where: Wherever you are :-)
Costs: Free of Charge
Join our three product experts as they guide you through new and exciting innovations in the world of materials characterization, starting with a brief introduction by Dr. Jürgen Blumm, CEO of the NETZSCH Business Unit Analyzing & Testing.
Our expert panel of presenters will guide you through the exciting developments in the field of materials characterization. We will cover news about:
- Differential Scanning Calorimetry (DSC), rethinking the core method in Thermal Analysis testing
- Dynamic-Mechanical Analysis (DMA) – news for all who are interested in a material’s mechanical behavior
- Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.Thermal Conductivity Testing (TCT) - a novel method in the NETZSCH portfolio, the Guarded Heat Flow Meter
This online event will be presented on December 5, 2023 at 9:00 am and 5:00 pm (CET).
Join us and be part of the future of materials analysis! Stay updated and register now:
Program of NETZSCH TECH TALK in Detail: