Glossary

• a

  • Accelerating Rate Calorimetry (ARC^®)
  • Added Carbon Black
  • Adiabatic
  • Adiabatic temperature rise
  • ARC^®-Module
  • Ash Content

• b

  • Burgers Model

• c

  • Carbon Black
  • Coefficient of Linear Thermal Expansion (CLTE/CTE)
  • Coin Cell Module
  • Complex Modulus
  • Complex Shear Modulus (G*)
  • Contact Resistance
  • Creep
  • Creep (Rheology)
  • Creep Compliance (J)
  • Creep Recovery
  • Cross over point
  • Crystallinity / Degree of Crystallinity
  • Crystallization
  • Crystallization Temperatures and Enthalpies
  • Curie Temperature
  • Curing (Crosslinking Reactions)

• d

  • Debinding
  • Decomposition reaction
  • Degree of Cure
  • Delamination (Time to Delamination)
  • Delta T(ad)
  • Delta T(obs)
  • Density
  • Dilatancy
  • Dilatant Flow Behaviour (Dilatency)
  • Drug-Excipient Compatibility

• e

  • Elastic modulus
  • Elasticity and Modulus of Elasticity
  • Electrical Conductivity (SBA)
  • Electrical Resistivity
  • Endothermic
  • Eutectic Purity
  • Exothermic
  • Exothermic threshold

• f

  • Fatigue test
  • Filler Content analysis
  • Flexometer Test

• g

  • G*/sinδ
  • Glass Transition Temperature

• h

  • Hagenbach Correction
  • Heat-Wait-Search (HWS)
  • Hooke’s Law

• i

  • Ion Viscosity
  • Isothermal

• l

  • Linear Viscoelastic Region (LVER)
  • Liquid Crystal Transitions

• m

  • Melting Temperatures and Enthalpies
  • Modulus of Elasticity
  • Mullins Effect
  • Multiple Module Calorimeter (MMC)
  • Multiple Stress Creep Recovery (MSCR)

• n

  • Newtonian
  • Non-Newtonian
  • Non-Recoverable Creep Compliance (Jnr)

• o

  • Oxidation
  • Oxidative-Induction Time (OIT) and Oxidative-Onset Temperature (OOT)

• p

  • Payne Effect
  • Performance-Graded (PG) Binder
  • Phase Angle δ
  • Phase Transitions
  • PHI-factor
  • Plastic Flow Behaviour
  • Polymorphism
  • Post Crystallization (Cold Crystallization)
  • Power Law Model
  • Pyrolysis
  • Pseudoplasticity
  • Pyrolytic Carbon

• r

  • Rabinowitsch Correction
  • Rate-Controlled Sintering (RCS)
  • Reaction Temperature and Reaction Enthalpy
  • Recoverable Creep Compliance (Jr)
  • Relaxation
  • Rolling Resistance

• s

  • Scanning Module
  • Seebeck Coefficient
  • Self-heating rate
  • Shear Modulus G*
  • Shear Thickening
  • Shear Thinning
  • Sintering
  • Solid-Gas Reactions
  • Solid-Solid Transitions
  • Sorption Process
  • Specific Heat Capacity (cp)
  • Strain
  • Stress
  • Stress Relaxation (Rheology)
  • Stress-Strain Behavior

• t

  • Tackiness
  • Tan delta
  • Temperature Retraction Test (TR Test)
  • Thermal Conductivity
  • Thermal Corrosion Studies
  • Thermal Diffusivity
  • Thermal hazard potential
  • Thermal inertia
  • Thermal Resistance
  • Thermal Stability
  • Thermal runaway
  • Thermally induced reaction
  • Thermophysical Properties
  • Thermoreflectance
  • Thixotropy
  • Time Domain

• v

  • Vaporization
  • Vibration
  • Viscosity
  • Viscous modulus
  • Volumetric Expansion

• w

  • Williams-Landel-Ferry Equation for Master Curve
  • Worst-Case Scenario

• y

  • Yield Stress
  • Young’s Modulus or Storage Modulus