Contract Testing 

Thermogravimetry (TGA)
ASTM E1131

Mass changes, Decomposition reactionA decomposition reaction is a thermally induced reaction of a chemical compound forming solid and/or gaseous products. decomposition, Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability

-180°C to 2400°C

Inert, oxidizing, reducing, static, dynamic, vacuum

Crucible volume: up to 5 ml

Differential Scanning  Calorimetry (DSC) 

ASTM E1269, E793, E794, D3895

Phase transformation temperatures and enthalpies, Specific Heat Capacity (cp)Heat capacity is a material-specific physical quantity, determined by the amount of heat supplied to specimen, divided by the resulting temperature increase. The specific heat capacity is related to a unit mass of the specimen.specific heat capacity, Oxidative-Induction Time (OIT) and Oxidative-Onset Temperature (OOT)Oxidative Induction Time (isothermal OIT) is a relative measure of the resistance of a (stabilized) material to oxidative decomposition. Oxidative-Induction Temperature (dynamic OIT) or Oxidative-Onset Temperature (OOT) is a relative measure of the resistance of a (stabilized) material to oxidative decomposition.oxidative-induction time

-180°C to 1650°C

Inert, oxidizing, static, dynamic, vacuum

Crucible volume: up to 190 µl

High-Pressure DSC 
(up to 15 MPa, 150 bar)

ASTM E1782

Phase transformation temperatures and enthalpies,  determination of vapor pressure and evaporation heat

-50°C to

 600°C

Inert, reducing, oxidizing, other gases on request

Crucible volume: up to 190 µl

Dilatometry (DIL) and  Thermomechanical Analysis (TMA)

ASTM E228, E831, E1545

Thermal expansion, Coefficient of Linear Thermal Expansion (CLTE/CTE)The coefficient of linear thermal expansion (CLTE) describes the length change of a material as a function of the temperature.CTE, DensityThe mass density is defined as the ratio between mass and volume. density changes Phase TransitionsThe term phase transition (or phase change) is most commonly used to describe transitions between the solid, liquid and gaseous states.phase transition temperatures, SinteringSintering is a production process for forming a mechanically strong body out of a ceramic or metallic powder. sintering process, softening, visco-elastic properties

-180°C to 2800°C

Inert, oxidizing,  reducing, vacuum

Standard size:  

25 mm*, Ø 6 mm*

Dynamic Mechanical Analysis (DMA)  

ASTM D5023

Visco-elastic behavior, Elastic modulusThe complex modulus (elastic component), storage modulus, or G’, is the “real” part of the samples the overall complex modulus. This elastic component indicates the solid like, or in phase, response of the sample being measurement. elastic modulus, Viscous modulusThe complex modulus (viscous component), loss modulus, or G’’, is the “imaginary” part of the samples the overall complex modulus. This viscous component indicates the liquid like, or out of phase, response of the sample being measurement. loss modulus 

-170°C to

 600°C

Inert, oxidizing

On request

Heat Flow Meter (HFM) and Guarded Hot Plate (GHP)

ASTM C177, C518

Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature. Thermal conductivity of insulating materials

-160°C to 

600°C

GHP: inert, oxidizing  

or vacuum

HFM: 305 x 305 mm*  

GHP: max. 300 x 300 mm

Guarded Heat Flow Meter (GHFM)

ASTM E1530

Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature. Thermal conductivity, thermal resistance

-50°C to 

200°C

Ambient

Ø 50 mm 

Laser/Light Flash Analysis (LFA)

ASTM E1461

Thermal DiffusivityThermal diffusivity (a with the unit mm2/s) is a material-specific property for characterizing unsteady heat conduction. This value describes how quickly a material reacts to a change in temperature.Thermal diffusivity and Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.thermal conductivity

-125°C to 2000°C

Inert, oxidizing,  

static and dynamic

Standard size: Ø 12.7 mm*

Rotational Rheology

ASTM D2196

Viscosity curves, flow curves, Yield StressYield stress is defined as the stress below which no flow occurs; literally behaves like a weak solid at rest and a liquid when yielded.yield stress, visco-Elastic modulusThe complex modulus (elastic component), storage modulus, or G’, is the “real” part of the samples the overall complex modulus. This elastic component indicates the solid like, or in phase, response of the sample being measurement. elastic modulus,  CreepCreep describes a time and temperature dependent plastic deformation under a constant force. When a constant force is applied to a rubber compound, the initial deformation obtained due to the application of the force is not fixed. The deformation will increase with time.creep & recovery, Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability 

-40°C to350°C

Ambient

25 - 50 g

Capillary Rheology

ASTM D3835

Melt viscosity, Cogswell extensional viscosity, Mooney wall slip assessment, flow Instability, die swell ratio, material degradation/Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability, specific volume of polymer melts, ultra-high shear rates viscosity measurements of fluids

RT to 500°C

Ambient

300 - 1000 g

Photo-DSC

Analysis of photo-initiated reactions, influence of UV stabilizers, UV-light Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing

-100°C to 

200°C

Inert, oxidizing, dynamic

Crucible volume: up to 85 µl

Differential Thermal Analysis  (DTA)

Phase transformation temperatures

-180°C to 2400°C

Inert, oxidizing, reducing, static, dynamic, vacuum

Crucible volume: up to 900 µl

Simultaneous Thermal  Analysis (STA)

Phase transformation temperatures and enthalpies, Specific Heat Capacity (cp)Heat capacity is a material-specific physical quantity, determined by the amount of heat supplied to specimen, divided by the resulting temperature increase. The specific heat capacity is related to a unit mass of the specimen.specific heat capacity, mass changes, Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability

-180°C to 2400°C

Inert, reducing, oxidizing, static, dynamic, vacuum

DSC pan: 190 μl

DTA crucible: 900 μl 

Evolved Gas Analysis  (EGA)

Characterization of gases emitted by means of MS, GC-MS or FT-IR, coupled to a TGA or STA

-180°C to 2000°C

On request

Time-Domain

ThermoreflectanceThermoreflectance is a method for determining the thermal diffusivity and thermal conductivity of thin films with thicknesses in the nanometer range.Thermoreflectance (TDTR)

Thermal DiffusivityThermal diffusivity (a with the unit mm2/s) is a material-specific property for characterizing unsteady heat conduction. This value describes how quickly a material reacts to a change in temperature.Thermal diffusivity and effusivity, interfacial resistance

RT to 500°C

Inert, oxidizing

Thin films (100 nm to 20 µm) with mirror polished surfaces (roughness  < 5 nm) on substrate

Dielectric Analysis (DEA)

ASTM E2039

Curing behavior of reactive polymers, dielectric loss factor, Ion ViscosityIon viscosity is the reciprocal value of the ion conductivity, which is calculated from the dielectric loss factor.ion viscosity, ion conductivity

RT to 400°C

Ambient

On request

Seebeck Analyzer (Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.SBA)

Seebeck coefficient, Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.electrical conductivity for thermoelectric materials

-125°C to 1100°C

Inert, oxidizing, reducing

Max. Ø 25.4 mm 

Accelerating Rate  

Calorimetry  (Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC^®®)

ASTM E1981

Thermal and pressure hazard evaluation, exotherm onset, Self-Accelerating Decomposition reactionA decomposition reaction is a thermally induced reaction of a chemical compound forming solid and/or gaseous products. Decomposition Temperature (SADT), Time-to-Maximum Rate (TMR), Emergency Relief Design (ERS) Data

RT to 500°C

Inert, oxidizing, reducing

1 ml to 130 ml

Multiple Module  

Calorimetry (Multiple Module Calorimeter (MMC)A multiple mode calorimeter device consisting of a base unit and exchangeable modules. One module is prepared for accelerating rate calorimetry (ARC), the ARC-Module. A second one is used for scanning tests (Scanning Module) and a third one is related to battery testing for coin cells (Coin Cell Module).MMC)

Scanning, IsothermalTests at controlled and constant temperature are called isothermal.isothermal and AdiabaticAdiabatic describes a system or measurement mode without any heat exchange with the surroundings. This mode can be realized using a calorimeter device according to the method of accelerating rate calorimetry (ARC). The main purpose of such a device is to study scenarios and thermal runaway reactions. A short description of the adiabatic mode is “no heat in – no heat out”.adiabatic calorimetry on gram-sized samples, pressure measurement

Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC^®/Scanning:  

RT to 500°C,  

Coin Cell ModuleA calorimeter module being part of the Multiple Module Calorimeter (MMC) allowing for scanning and isothermal tests of complete coins of variable size. The DSC-like twin design gives a differential signal of the heat signature during a heating ramp or charging and discharging of batteries.Coin Cell:  

RT to 300°C

Inert, oxidizing, reducing

Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC^® Module: 0.1 to 8.5 ml; Scanning: 0.1 to 8.5 ml; Coin Cell ModuleA calorimeter module being part of the Multiple Module Calorimeter (MMC) allowing for scanning and isothermal tests of complete coins of variable size. The DSC-like twin design gives a differential signal of the heat signature during a heating ramp or charging and discharging of batteries.Coin Cell: Typically CR2032, Diameter: 5 to 25 mm, Thickness: 1 to 5 mm

IsothermalTests at controlled and constant temperature are called isothermal.Isothermal Battery  

Calorimetry (IBC)

IsothermalTests at controlled and constant temperature are called isothermal.Isothermal battery calorimetry, heat management, efficiency, performance and in-situ cycling

-30°C to 

60°C

Inert

Max. Battery Size:  

30 x 20 x 15 cm

Oxygen Index Analyzer (LOI)

ASTM D2863

Limited oxygen index, flammability of plastics, burning time,  burning distance

Ambient

O₂, N₂ measuring gasses

6.5 mm x 3.0 mm x  

70-150 mm, rod-shaped specimen 52 mm x  

140 mm, flat specimens, thickness as manufactured

Kinetics as a Service

Comprehensive package for kinetic evaluation, prediction and process optimization. Available for different methods incl. DSC, TGA, STA, DIL, etc.

Depending on process

Depending on  

process

Depending on method