Photo-DSC | Analysis of photo-initiated reactions, influence of UV stabilizers, UV-light Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing | -100°C to 200°C | Inert, oxidizing, dynamic | Crucible volume: up to 85 µl |
Differential Thermal Analysis (DTA) | Phase transformation temperatures | -180°C to 2400°C | Inert, oxidizing, reducing, static, dynamic, vacuum | Crucible volume: up to 900 µl |
Simultaneous Thermal Analysis (STA) | Phase transformation temperatures and enthalpies, Specific Heat Capacity (cp)Heat capacity is a material-specific physical quantity, determined by the amount of heat supplied to specimen, divided by the resulting temperature increase. The specific heat capacity is related to a unit mass of the specimen.specific heat capacity, mass changes, Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability | -180°C to 2400°C | Inert, reducing, oxidizing, static, dynamic, vacuum | DSC pan: 190 μl DTA crucible: 900 μl |
Evolved Gas Analysis (EGA) | Characterization of gases emitted by means of MS, GC-MS or FT-IR, coupled to a TGA or STA | -180°C to 2000°C | | On request |
Time-Domain ThermoreflectanceThermoreflectance is a method for determining the thermal diffusivity and thermal conductivity of thin films with thicknesses in the nanometer range.Thermoreflectance (TDTR) | Thermal DiffusivityThermal diffusivity (a with the unit mm2/s) is a material-specific property for characterizing unsteady heat conduction. This value describes how quickly a material reacts to a change in temperature.Thermal diffusivity and effusivity, interfacial resistance | RT to 500°C | Inert, oxidizing | Thin films (100 nm to 20 µm) with mirror polished surfaces (roughness < 5 nm) on substrate |
Dielectric Analysis (DEA) ASTM E2039 | Curing behavior of reactive polymers, dielectric loss factor, Ion ViscosityIon viscosity is the reciprocal value of the ion conductivity, which is calculated from the dielectric loss factor.ion viscosity, ion conductivity | RT to 400°C | Ambient | On request |
Seebeck Analyzer (Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.SBA) | Seebeck coefficient, Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.electrical conductivity for thermoelectric materials | -125°C to 1100°C | Inert, oxidizing, reducing | Max. Ø 25.4 mm |
Accelerating Rate Calorimetry (Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC®®) ASTM E1981 | Thermal and pressure hazard evaluation, exotherm onset, Self-Accelerating Decomposition Temperature (SADT), Time-to-Maximum Rate (TMR), Emergency Relief Design (ERS) Data | RT to 500°C | Inert, oxidizing, reducing | 1 ml to 130 ml |
Multiple Module Calorimetry (Multiple Module Calorimeter (MMC)A multiple mode calorimeter device consisting of a base unit and exchangeable modules. One module is prepared for accelerating rate calorimetry (ARC), the ARC-Module. A second one is used for scanning tests (Scanning Module) and a third one is related to battery testing for coin cells (Coin Cell Module).MMC) | Scanning, IsothermalTests at controlled and constant temperature are called isothermal.isothermal and AdiabaticAdiabatic describes a system or measurement mode without any heat exchange with the surroundings. This mode can be realized using a calorimeter device according to the method of accelerating rate calorimetry (ARC). The main purpose of such a device is to study scenarios
and thermal runaway reactions. A short description of the adiabatic mode is “no heat in – no heat out”.adiabatic calorimetry on gram-sized samples, pressure measurement | Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC®/Scanning: RT to 500°C, Coin Cell ModuleA calorimeter module being part of the Multiple Module Calorimeter (MMC) allowing for scanning and isothermal tests of complete coins of variable size. The DSC-like twin design gives a differential signal of the heat signature during a heating ramp or charging and discharging of batteries.Coin Cell: RT to 300°C | Inert, oxidizing, reducing | Accelerating Rate Calorimetry (ARC)The method describing isothermal and adiabatic test procedures used to detect thermally exothermic decomposition reactions.ARC® Module: 0.1 to 8.5 ml; Scanning: 0.1 to 8.5 ml; Coin Cell ModuleA calorimeter module being part of the Multiple Module Calorimeter (MMC) allowing for scanning and isothermal tests of complete coins of variable size. The DSC-like twin design gives a differential signal of the heat signature during a heating ramp or charging and discharging of batteries.Coin Cell: Typically CR2032, Diameter: 5 to 25 mm, Thickness: 1 to 5 mm |
IsothermalTests at controlled and constant temperature are called isothermal.Isothermal Battery Calorimetry (IBC) | IsothermalTests at controlled and constant temperature are called isothermal.Isothermal battery calorimetry, heat management, efficiency, performance and in-situ cycling | -30°C to 60°C | Inert | Max. Battery Size: 30 x 20 x 15 cm |
Oxygen Index Analyzer (LOI) ASTM D2863 | Limited oxygen index, flammability of plastics, burning time, burning distance | Ambient | O2, N2 measuring gasses | 6.5 mm x 3.0 mm x 70-150 mm, rod-shaped specimen 52 mm x 140 mm, flat specimens, thickness as manufactured |
Kinetics as a Service | Comprehensive package for kinetic evaluation, prediction and process optimization. Available for different methods incl. DSC, TGA, STA, DIL, etc. | Depending on process | Depending on process | Depending on method |