Bradford Hammond
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Our Laboratory Expertise
The NETZSCH Thermal Analysis Applications Laboratories are a proficient partner for nearly all thermal analysis issues. Our involvement in your projects begins with painstaking sample preparation and continues through meticulous examination and interpretation of the measurement results. Our diverse methods and over 30 different state-of-the-art measuring stations will provide ready solutions for all your special questions. Customers of our laboratory services stem from a wide range of large companies in industries such as chemical, automotive, electronics, air/space travel, racing, and polymer and ceramics.
You will receive high-precision measurement results and valuable interpretations from us in the shortest possible time.
NETZSCH Instruments Contract Testing Services enables you to exactly specify new materials and components before actual deployment, minimizing risk of failure, and gaining decisive advantages over your competitors. For production problems, we can work with you to analyze causal issues and work out solution concepts. The relatively low expense of investment in our test measurements and services will pay off by greatly reducing your down time and reject rates. In addition, you will be able to increase the satisfaction of your existing customers and to win new ones.
NETZSCH Instruments North America, LLC was accredited to the ISO/IEC 17025:2017 standard. It enables laboratories to demonstrate that they operate competently and produce valid results, both nationally and around the world. It helps facilitate cooperation between laboratories and other bodies by generating wider acceptance of results between countries. Test reports and certificates from our US lab can be accepted from other countries without the need for further testing.
Method (ASTM where applicable) | Recordable Information | Temperature range | Gases | Sample size |
---|---|---|---|---|
Thermogravimetry (TGA) | Mass changes, Decomposition reactionA decomposition reaction is a thermally induced reaction of a chemical compound forming solid and/or gaseous products. decomposition, thermal stability | -180°C to 2400°C | Inert, oxidizing, reducing, static, dynamic, vacuum | Crucible volume: up to 5 ml |
Differential Scanning Calorimetry (DSC) ASTM E1269, E793, E794, D3895 | Phase transformation temperatures and enthalpies, Specific Heat Capacity (cp)Heat capacity is a material-specific physical quantity, determined by the amount of heat supplied to specimen, divided by the resulting temperature increase. The specific heat capacity is related to a unit mass of the specimen.specific heat capacity, oxidative-induction time | -180°C to 1650°C | Inert, oxidizing, static, dynamic, vacuum | Crucible volume: up to 190 µl |
High-Pressure DSC ASTM E1782 | Phase transformation temperatures and enthalpies, determination of vapor pressure and evaporation heat | -50°C to 600°C | Inert, reducing, oxidizing, other gases on request | Crucible volume: up to 190 µl |
Photo-DSC | Analysis of photo-initiated reactions, influence of UV stabilizers, UV-light Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing | -100°C to 200°C | Inert, oxidizing, dynamic | Crucible volume: up to 85 µl |
Differential Thermal Analysis (DTA) | Phase transformation temperatures | -180°C to 2400°C | Inert, oxidizing, reducing, static, dynamic, vacuum | Crucible volume: up to 900 µl |
Simultaneous Thermal Analysis (STA) | Phase transformation temperatures and enthalpies, specific heat capacity, mass changes, thermal stability | -180°C to 2400°C | Inert, reducing, oxidizing, static, dynamic, vacuum | DSC pan: 190 μl DTA crucible: 900 μl |
Evolved Gas Analysis (EGA) | Characterization of gases emitted by means of MS, GC-MS or FT-IR, coupled to a TGA or STA | -180°C to 2000°C | On request | |
Dilatometry (DIL) and Thermomechanical Analysis (TMA) ASTM E228, E831, E1545 | Thermal expansion, Coefficient of Linear Thermal Expansion (CLTE/CTE)The coefficient of linear thermal expansion (CLTE) describes the length change of a material as a function of the temperature.CTE, DensityThe mass density is defined as the ratio between mass and volume. density changes Phase TransitionsThe term phase transition (or phase change) is most commonly used to describe transitions between the solid, liquid and gaseous states.phase transition temperatures, SinteringSintering is a production process for forming a mechanically strong body out of a ceramic or metallic powder. sintering process, softening, visco-elastic properties | -180°C to 2800°C | Inert, oxidizing, reducing, vacuum | Standard size: 25 mm*, Ø 6 mm* |
Dynamic Mechanical Analysis (DMA) ASTM D5023 | Visco-elastic behavior, Elastic modulusThe complex modulus (elastic component), storage modulus, or G’, is the “real” part of the samples the overall complex modulus. This elastic component indicates the solid like, or in phase, response of the sample being measurement. elastic modulus, Viscous modulusThe complex modulus (viscous component), loss modulus, or G’’, is the “imaginary” part of the samples the overall complex modulus. This viscous component indicates the liquid like, or out of phase, response of the sample being measurement. loss modulus | -170°C to 600°C | Inert, oxidizing | On request |
Heat Flow Meter (HFM) and Guarded Hot Plate (GHP) ASTM C177, C518 | Thermal conductivity of insulating materials | -160°C to 600°C | GHP: inert, oxidizing or vacuum | HFM: 305 x 305 mm* GHP: max. 300 x 300 mm |
Guarded Heat Flow Meter (GHFM) ASTM E1530 | Thermal conductivity, thermal resistance | -50°C to 200°C | Ambient | Ø 50 mm |
Laser/Light Flash Analysis (LFA) ASTM E1461 | Thermal DiffusivityThermal diffusivity (a with the unit mm2/s) is a material-specific property for characterizing unsteady heat conduction. This value describes how quickly a material reacts to a change in temperature.Thermal diffusivity and Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.thermal conductivity | -125°C to 2000°C | Inert, oxidizing, static and dynamic | Standard size: Ø 12.7 mm* |
Time-Domain | Thermal diffusivity and effusivity, interfacial resistance | RT to 500°C | Inert, oxidizing | Thin films (100 nm to 20 µm) with mirror polished surfaces (roughness < 5 nm) on substrate |
Dielectric Analysis (DEA) ASTM E2039 | Curing behavior of reactive polymers, dielectric loss factor, ion viscosity, ion conductivity | RT to 400°C | Ambient | On request |
Seebeck Analyzer (Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.SBA) | Seebeck coefficient, Electrical Conductivity (SBA)Electrical conductivity is a physical property indicating a material's ability to allow the transport of an electric charge.electrical conductivity for thermoelectric materials | -125°C to 1100°C | Inert, oxidizing, reducing | Max. Ø 25.4 mm |
Rotational Rheology ASTM D2196 | Viscosity curves, flow curves, yield StressStress is defined as a level of force applied on a sample with a well-defined cross section. (Stress = force/area). Samples having a circular or rectangular cross section can be compressed or stretched. Elastic materials like rubber can be stretched up to 5 to 10 times their original length.stress, visco-elastic modulus, CreepCreep describes a time and temperature dependent plastic deformation under a constant force. When a constant force is applied to a rubber compound, the initial deformation obtained due to the application of the force is not fixed. The deformation will increase with time.creep & recovery, thermal stability | -40°C to350°C | Ambient | 25 - 50 g |
Capillary Rheology ASTM D3835 | Melt viscosity, Cogswell extensional viscosity, Mooney wall slip assessment, flow Instability, die swell ratio, material degradation/thermal stability, specific volume of polymer melts, ultra-high shear rates viscosity measurements of fluids | RT to 500°C | Ambient | 300 - 1000 g |
Accelerating Rate ASTM E1981 | Thermal and pressure hazard evaluation, exotherm onset, Self-Accelerating Decomposition Temperature (SADT), Time-to-Maximum Rate (TMR), Emergency Relief Design (ERS) Data | RT to 500°C | Inert, oxidizing, reducing | 1 ml to 130 ml |
Multiple Module | Scanning, IsothermalTests at controlled and constant temperature are called isothermal.isothermal and AdiabaticAdiabatic describes a system or measurement mode without any heat exchange with the surroundings. This mode can be realized using a calorimeter device according to the method of accelerating rate calorimetry (ARC). The main purpose of such a device is to study scenarios and thermal runaway reactions. A short description of the adiabatic mode is “no heat in – no heat out”.adiabatic calorimetry on gram-sized samples, pressure measurement | ARC®/Scanning: RT to 500°C, Coin Cell: RT to 300°C | Inert, oxidizing, reducing | ARC® Module: 0.1 to 8.5 ml; Scanning: 0.1 to 8.5 ml; Coin Cell: Typically CR2032, Diameter: 5 to 25 mm, Thickness: 1 to 5 mm |
IsothermalTests at controlled and constant temperature are called isothermal.Isothermal Battery Calorimetry (IBC) | Isothermal battery calorimetry, heat management, efficiency, performance and in-situ cycling | -30°C to 60°C | Inert | Max. Battery Size: 30 x 20 x 15 cm |
Oxygen Index Analyzer (LOI) ASTM D2863 | Limited oxygen index, flammability of plastics, burning time, burning distance | Ambient | O2, N2 measuring gasses | 6.5 mm x 3.0 mm x 70-150 mm, rod-shaped specimen 52 mm x 140 mm, flat specimens, thickness as manufactured |
Kinetics as a Service | Comprehensive package for kinetic evaluation, prediction and process optimization. Available for different methods incl. DSC, TGA, STA, DIL, etc. | Depending on process | Depending on process | Depending on method |
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