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DMA Eplexor® HT Series up to 500 N

For ceramics, metals, alloys, glasses, composites and more 

Highlights

The DMA GABO Eplexor® HT line is the only instrument series on the market which is able to carry out DMA measurements with a maximum dynamic force of 500 N to 1500°C.

Two high-temperature furnaces are available: RT to 1000°C and RT to 1500°C. With a standard furnace (-160°C to 500°C) simultaneously mounted, it is possible to perform consecutive test runs in both the low- and high-temperature range. Eplexor® HT instruments can thus cover the entire temperature span from -160°C to 1500°C.

The electronics within the system automatically identify which furnace is currently in use.

The following DMA GABO Eplexor® HT are available:

Instrument TypeMax. Static ForceMax. Dynamic Force *)
DMA GABO Eplexor® 25N HT1500 N± 25 N
DMA GABO Eplexor® 100N HT1500 N± 100 N
DMA GABO Eplexor® 150N HT1500 N± 150 N
DMA GABO Eplexor® 500N HT1500 N± 500 N

Method

The Dynamic Mechanical Thermal Analyzer applies forced periodic loads to the sample and analyzes the phase shift between this primary excitation and the material’s response. The response of an ideal elastic system (e.g., spring) on a sinusoidal load at a given frequency is of the same frequency and exactly in phase with the excitation. The situation changes in a real system: A phase shift (δ > 0°) between the primary excitation and response of the same frequency occurs in the case of linear visco-elastic materials (e.g., polymers).

Elastic and non-elastic properties inherently describe the dynamic mechanical performance of the material. The storage modulus E’, the real part of the Complex ModulusThe complex modulus consists of two components, the storage and the loss moduli. The storage modulus (or Young’s modulus) describes the stiffness and the loss modulus describes the damping (or viscoelastic) behavior of the corresponding sample using the method of Dynamic Mechanical Analysis (DMA). complex modulus E*, represents the elastic component; the Viscous modulusThe complex modulus (viscous component), loss modulus, or G’’, is the “imaginary” part of the samples the overall complex modulus. This viscous component indicates the liquid like, or out of phase, response of the sample being measurement. loss modulus E’’, the dissipated part, is the imaginary part. Depicted in the complex plane, the loss and storage modulus are the projections of the Complex ModulusThe complex modulus consists of two components, the storage and the loss moduli. The storage modulus (or Young’s modulus) describes the stiffness and the loss modulus describes the damping (or viscoelastic) behavior of the corresponding sample using the method of Dynamic Mechanical Analysis (DMA). complex modulus onto the real and imaginary axis. The tangent of the angle between the real axis and the Complex ModulusThe complex modulus consists of two components, the storage and the loss moduli. The storage modulus (or Young’s modulus) describes the stiffness and the loss modulus describes the damping (or viscoelastic) behavior of the corresponding sample using the method of Dynamic Mechanical Analysis (DMA). complex modulus (E*) represents the phase shift (tanδ) between the two.

Specifications

Technical Data

Temperature Range
-160°C to 1500°C
the full temperature range can be covered if the instrument is equipped with the low-temperature and one high-temperature furnace
Frequency Range
0.01 to 100 Hz; 
optional: 0.0001 Hz; 200 Hz
Static Force Range
max. 1500 N
  • Dynamic force range:
    from ± 25 N up to ± 500 N (depending on instrument type, see table)
  • Force sensor:
    interchangeable; nominal forces available from 10 N to 500 N (depending on the instrument type and configuration)
  • Static displacement: 
    max. 60 mm
  • Dynamic amplitude:
    from ± 1.5 mm up to ± 6 mm (depending on the instrument type and system configuration)
  • Measurement modes for applications above 500°C:
    asymmetric and 3/4-point bending, compression
  • Work space of the high-temperature furnaces:
    cylindrical chamber, diameter: 70 mm, height: 120 mm

Software

The comprehensive DMA GABO Eplexor® HT Series software is based on Windows operating systems. The extensive software package comprises data and curve analyses, hysteresis representation, master curve calculations, etc.
It also includes specific templates for tension, compression or bending tests.

The software features include:

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