Thermoelectric

Thermoelectric Materials in Details

The Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability (analyzed with TGA or DSC) yields information on the maximum service temperature.

STA-MS measurements are ideal for understanding the Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability of thermoelectric components.

Differential Scanning Calorimetry (DSC) can be used for the analysis of Phase TransitionsThe term phase transition (or phase change) is most commonly used to describe transitions between the solid, liquid and gaseous states.phase transitions or specific heat.

Our LFA models carry out fast and reliable Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.thermal conductivity measurements by flash diffusivity methods on small and thin samples across the entire spectrum of possible materials and temperatures.

For the precise measurement of Thermal DiffusivityThermal diffusivity (a with the unit mm2/s) is a material-specific property for characterizing unsteady heat conduction. This value describes how quickly a material reacts to a change in temperature.thermal diffusivity, specific heat and Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.thermal conductivity, the Laser/Light Flash technique (LFA) has proven itself as a fast, versatile and exact absolute method.

DIL or DMA methods are used to characterize the thermal expansion and the visco-elastic properties of materials, allowing for the analysis and prediction of thermal stresses in a real device.