Thermal Analysis of UF Adhesives: From Curing Behavior to Stability with NETZSCH DSC and TGA

A recent study published in the European Journal of Wood and Wood Products investigates the integration of propolis into UF adhesives, focusing on its effects on Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing kinetics, Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability, and mechanical properties. Using advanced analytical techniques such as Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA), the research highlights the potential of propolis to improve both the environmental profile and performance of UF-based wood composites.

Thermal Analysis of UF Adhesives: From Curing Behavior to Stability with NETZSCH DSC and TGA

To understand how propolis affects the Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing kinetics of UF resins, Differential Scanning Calorimetry (DSC) was performed using the NETZSCH DSC 214 Polyma. Applying high-pressure crucibles (stainless steel crucibles for measurements under high pressure) under a nitrogen atmosphere minimized water evaporation artifacts, revealing a clear acceleration in the Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing (cross-linking) reaction.

Complementary Thermogravimetric Analysis (TGA), conducted with the NETZSCH TG 209 F1 Libra^®, provided insights into the thermal degradation profile of the cured adhesives. These results confirmed that propolis enhances the Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability of the thermoset network, supporting its role as a functional bio-based additive.

Beyond thermal behavior, the study assessed the mechanical strength, moisture resistance, and formaldehyde emissions of particleboards bonded with propolis-modified UF adhesives. The findings demonstrate that, when properly formulated, bio-based additives can improve performance while reducing environmental impact, key goals in the development of low-emission wood composites.

This research highlights the potential of natural resin additives to bridge the gap between sustainability and industrial performance in engineered wood products. By combining renewable raw materials with advanced thermal analysis, scientists and manufacturers can accelerate the transition toward eco-friendly adhesive systems.

A full description of the experimental procedures and analytical results is available in the peer reviewed article. (Access via publisher; subscription or one-time purchase may be required).

Acknowledgements

This study was a collaborative effort among Poznan University of Life Sciences (Faculty of Forestry and Wood Technology), Poznan University of Technology (Institute of Materials Technology), and NETZSCH Instrumenty, Poland. We gratefully acknowledge the valuable contributions of the authors and the support provided by their respective institutions.