DMA 523 Eplexor^® High-Force Series

The technologically sophisticated DMA GABO Eplexor^® 8 software is a perfect match for the DMA instrument. The software is based on the Windows™ operating system and offers comprehensive possibilities for data and curve analyses.

Predefined software packages are available in accordance with the selected clamping devices such as tension, compression or bending.  

The software features are:

• Frequency sweep (0.01 - 100 Hz; optional 200 Hz; optional 0.0001 Hz; also optional: multi-frequency sweep)
• Time sweep
• Temperature sweep
• Static and dynamic StressStress is defined as a level of force applied on a sample with a well-defined cross section. (Stress = force/area). Samples having a circular or rectangular cross section can be compressed or stretched. Elastic materials like rubber can be stretched up to 5 to 10 times their original length.stress or StrainStrain describes a deformation of a material, which is loaded mechanically by an external force or stress. Rubber compounds show creep properties, if a static load is applied.strain sweep
• Temperature and frequency sweep – IsothermalTests at controlled and constant temperature are called isothermal.Isothermal frequency changes (temperature steps)
• Constant StressStress is defined as a level of force applied on a sample with a well-defined cross section. (Stress = force/area). Samples having a circular or rectangular cross section can be compressed or stretched. Elastic materials like rubber can be stretched up to 5 to 10 times their original length.stress amplitude mode per ASTM D623 (heat build-up test with static load and dynamic deformation – optional)
• Universal test driven by the servo motor (optional) or by the shaker (optional) -
• Time-temperature superposition – TTS (WLF, Arrhenius, numeric – optional)
• Evaluation of Complex ModulusThe complex modulus consists of two components, the storage and the loss moduli. The storage modulus (or Young’s modulus) describes the stiffness and the loss modulus describes the damping (or viscoelastic) behavior of the corresponding sample using the method of Dynamic Mechanical Analysis (DMA). complex modulus (E*, G*), storage modulus (E’, G’), Viscous modulusThe complex modulus (viscous component), loss modulus, or G’’, is the “imaginary” part of the samples the overall complex modulus. This viscous component indicates the liquid like, or out of phase, response of the sample being measurement. loss modulus (E´´, G´´), damping factor (tand), Glass Transition TemperatureThe glass transition is one of the most important properties of amorphous and semi-crystalline materials, e.g., inorganic glasses, amorphous metals, polymers, pharmaceuticals and food ingredients, etc., and describes the temperature region where the mechanical properties of the materials change from hard and brittle to more soft, deformable or rubbery.glass transition temperature, and optional CreepCreep describes a time and temperature dependent plastic deformation under a constant force. When a constant force is applied to a rubber compound, the initial deformation obtained due to the application of the force is not fixed. The deformation will increase with time.creep, RelaxationWhen a constant strain is applied to a rubber compound, the force necessary to maintain that strain is not constant but decreases with time; this behavior is known as stress relaxation. The process responsible for stress relaxation can be physical or chemical, and under normal conditions, both will occur at the same time. relaxation and retardation, fatigue, energy loss, Payne/Mullins effect analysis and crack growth testing -
• Hysteresis presentation of results (optional)
• Determination of thermal expansion (for tension mode – optional)
• Prediction of the Rolling ResistanceThe rolling resistance is a force resisting the motion when a body is rolling across a surface. This determines the slip resistance of, e.g., car or truck tires.rolling resistance of tires (optional)

Sample Holders for a Variety of Applications
Samples of varied geometries and properties require adapted sample holders. To this end, NETZSCH offers a great selection of sample holders and measurement modes including specialties such as a holder for tire cord testing or for Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing resins and liquids, respectively.

UV Extension
Initiation of reactions by UV light; for example, UV Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing of reactive resin systems

Humidity Generator (HYGROMATOR^®)
For carrying out measurements in humid atmospheres or for determining a sample’s water uptake. Technical data for the HYGROMATOR^®:

• 5% to 95% relative humidity
• Temperature range between 5°C and 95°C

Immersion Bath
For tension, bending and compression mode; for the investigation of aging or plasticizer effects caused by contact with water or oil.  

Goodrich Flexometer Module
Applies a cyclic load to a sample and detects the resulting heat generation during compression (heat build-up).  

Cooling Options
Two different types: LN₂ cooling (down to -150°C) and air chiller (down to -60°C); intended for use with the standard furnace (-150°C to 500°C).