Webinar series

Cure Intelligence with Dielectric Analysis (DEA)

From measurement fundamentals to process-relevant cure insights

Cure Intelligence with Dielectric Analysis (DEA) is a three-part webinar series designed for scientists, material developers and process engineers working with thermosets, adhesives, composites, coatings and inks.

Explore how dielectric analysis can help you understand, monitor and optimize curing reactions - from the fundamental measurement principles to the interpretation of real-world data and advanced combined measurement approaches. The series demonstrates how DEA provides valuable insight into molecular mobility, reaction progress and cure kinetics, both in the laboratory and directly within the process.

Across the three webinars, you will learn how to select suitable DEA measurement methods, evaluate isothermal and dynamic measurements, determine the degree of cure and relate dielectric behavior to practical processing conditions. The final session expands this perspective by combining DEA with rotational rheometry, connecting microscopic changes during cure with macroscopic properties such as viscosity development and gelation.

Join the series to turn cure data into a deeper understanding of your material - and more confident process decisions.