FREE WEBINAR
A Complete Cure Profile: Combining Rheology and Dielectric Analysis
Session 1: December 3rd, 2026 | 10 - 11 a.m. CET
Understanding cure progression is key to optimizing processes, ensuring quality and predicting the performance of the final material. By combining rotational rheometry and dielectric analysis in a single experiment, it is possible to capture complementary information throughout the curing process.
In this webinar, we introduce the new DEA cartridge for the NETZSCH Kinexus rheometer. While rheological measurements provide insight into viscosity development, mechanical changes and gelation behavior, the DEA 288 Ionic dielectric analyzer tracks Ionic mobility and molecular dynamics associated with the curing reaction.
Discover how the combined approach helps connect microscopic cure behavior with macroscopic material response—enabling a more complete and process-relevant understanding of cure.