03.06.2025 by Aileen Sammler
NEW NETZSCH TECH TALK: Discover the Future of Thermal Analysis in Just 30 Minutes!
It’s time to mark your calendar! On July 2, 2025, NETZSCH invites you to a brand-new TECH TALK - a fast-paced, free online event spotlighting the latest innovations in thermal analysis.
It’s time to mark your calendar! On July 2, 2025, NETZSCH invites you to a brand-new TECH TALK — a fast-paced, free online event spotlighting the latest innovations in thermal analysis.
In just 30 minutes, you’ll get expert insights into the new generation of HFM (Heat Flow Meters), DIL (Dilatometers), and TMA (Thermo-Mechanical Analyzers). Whether you're a seasoned professional or new to the field, this TECH TALK has something for you!
What to expect:
Our TECH TALK series offers a condensed, 30-minute presentation, highlighting cutting-edge technological innovations in thermal analysis. And the best part? Participation is totally free of charge!
We promise, this new session will feature remarkable developments in thermal analysis and material characterization, from smarter workflows to next-level instrument capabilities with our brand-new HFM (NETZSCH Heat Flow Meters), DIL (Dilatometers) and TMA (Thermo-Mechanical Analyzers) instrument series.
Event Details:
- 🗓 Date: July 2, 2025
- 🕘 Times: 9 a.m. and 4 p.m.
The event kicks off with a brief introduction by Torsten Remmler, our renowned rheology expert at NETZSCH Analyzing & Testing, who will guide you through the sessions, and the discussions with our experts. Attendees will enjoy three informative, but exciting sessions tailored to beginners and professionals, eager to stay updated on the latest trends in material science:
1. Measure faster, evaluate more reliably, and document smarter!
Looking for maximum precision with minimum effort? Discover the all-new HFM 706 Lambda Series – the most advanced solution for measuring the Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.thermal conductivity of insulation materials.
Your Presenter:
Fabia Beckstein, LFA, HFM, GHP, GHFM Application Expert at NETZSCH
2. Measure shrinkage, sintering behavior, softening points or phase transitions from -180°C to 2800°C!
From ceramics and glass to metals, polymers, and composites – the new DIL 502 Expedis® series sets new standards in high-precision dilatometry.
Your presenter:
Dr. Dmitry Sergeev, NETZSCH Application Expert for High-Temperature Applications
3. Investigate dimensional changes under real-world conditions
From fiber expansion to molten salts, from swelling in humid atmospheres to high-temperature CreepCreep describes a time and temperature dependent plastic deformation under a constant force. When a constant force is applied to a rubber compound, the initial deformation obtained due to the application of the force is not fixed. The deformation will increase with time.creep – the new TMA 512 Series delivers unmatched versatility for thermo mechanical analysis.
Your Presenter:
Dr. Georg Storch, Head of Experimental Workshop and TMA Expert at NETZSCH
Join our product experts, as they will take you again on an exciting journey through the latest and most innovative NETZSCH HFM, DIL and TMA instruments in the world of material characterization.
Be part of the future of materials analysis! We are looking forward to seeing you online at this engaging and informative event!