Join Us for Our Upcoming TECH TALK: Innovations in Thermal Analysis!

What is TECH TALK?
Our TECH TALK series offers a condensed, 30-minute presentation highlighting cutting-edge technological innovations in thermal analysis, and the best part? Participation is completely free!

While we can’t reveal all the details just yet, we promise this session will feature remarkable developments in thermal analysis and material characterization, particularly in high-temperature and high-pressure environments.

Event Details:
🗓 Date: December 5th
🕘 Times: 9 a.m. and 4 p.m.

The event kicks off with a brief introduction by Dr. Martin Brunner, our Head of R&D. Following this, attendees will enjoy four informative sessions designed specifically for professionals eager to stay updated on the latest trends in materials science.

Mark your calendars and prepare to be inspired! 

We look forward to seeing you online for this engaging and informative event!

Join our product experts, Dr. Michael Schöneich, Dr. André Lindemann, and Dr. Wiebold Wurpts, as they lead you on an exciting journey through the latest and most innovative instruments in the world of materials characterization.

1.      Introducing our Latest Instrument for Precise c_p Measurements 

2.      Exploring the Innovations in Thermal ConductivityThermal conductivity (λ with the unit W/(m•K)) describes the transport of energy – in the form of heat – through a body of mass as the result of a temperature gradient (see fig. 1). According to the second law of thermodynamics, heat always flows in the direction of the lower temperature.Thermal Conductivity

3.      Exciting Innovations for the Dynamic Mechanical Analyzer NETZSCH DMA 303 Eplexor^®

4.      Setting New Measurement Standards in the High-Force Range

Join us and be part of the future of materials analysis!