Material Characterization for Semiconductors

Solve Thermal and Mechanical Material Challenges in Semiconductor Development

NETZSCH helps semiconductor and electronic-material teams characterize material behavior for R&D, process development, packaging reliability and quality control.

Talk to our experts to find the right analytical method and instrument for your semiconductor application!

Talk to a Semiconductor Materials Specialist

Discuss your material, application or testing challenge with our team.

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Find the Right Characterization Approach for Your Application

The suitable method depends on your material, the question you need to answer and your lab workflow. Our specialists help identify an appropriate approach.

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Laser Flash Analysis (LFA)

Measure thermal diffusivity as a function of temperature to determine thermal conductivity and evaluate heat-transfer performance in solids, including semiconductor materials, ceramics and thermal interface materials.

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PicoTR / NanoTR

Measure thermal diffusivity and thermal conductivity in thin films and microstructured materials, supporting the evaluation of heat transport in semiconductor devices, coatings and thermal interface materials.

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Differential Scanning Calorimetry (DSC)

Investigate thermal transitions, melting and crystallization behavior, curing reactions and heat-capacity-related material properties.

Discuss Your Application With an Expert

Discuss your material, application or testing challenge with our team.

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When Material Performance Matters, the Right Data Makes the Difference

Semiconductor materials must perform reliably under demanding thermal, mechanical and processing conditions. Whether you are developing new materials, investigating a failure or establishing a quality-control workflow, meaningful characterization data supports faster and more confident decisions.

Understand thermal behavior
Evaluate transitions, Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing behavior, Decomposition reactionA decomposition reaction is a thermally induced reaction of a chemical compound forming solid and/or gaseous products. decomposition and Thermal StabilityA material is thermally stable if it does not decompose under the influence of temperature. One way to determine the thermal stability of a substance is to use a TGA (thermogravimetric analyzer). thermal stability of electronic materials, polymers, adhesives, encapsulants or other packaging-related materials.
Support material and process development
Compare material formulations, assess processing windows and generate data to support product and process decisions.
Investigate reliability-related material changes
Examine how temperature, time, atmosphere or mechanical loading can affect material behavior.

Talk to a Semiconductor Materials Specialist

Tell us about your material, application or testing objective. A NETZSCH representative will contact you to discuss suitable next steps.

Talk to a Semiconductor Materials Specialist

Discuss your material, application or testing challenge with our team.

Contact NETZSCH Sales

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