Material Science in Additive Manufacturing: Warpage Prediction of PBF Parts Using CTE

In our last episodes, we focused mainly on thermal material behavior measured with Differential Scanning Calorimetry (DSC). Today, Dr. Nathalie Rudolph will talk In our last video, we talked about how residual stress can lead to warpage of a 3D-printed part and how Dynamic Mechanical Analysis (DMA) can help estimate residual stress. Today, Dr. Natalie Rudolph explains how warpage can be predicted using the coefficient of thermal expansion (CTE) with the help of Thermomechanical Analysis (TMA).

This week’s topic: Warpage Prediction of PBF Parts Using CTE

We use Thermomechanical Analysis (TMA) to measure the deformation of a substance under a non-oscillatory load as a function of temperature and time while the substance is subjected to a controlled temperature program in a specific atmosphere.

Learn about:

• How to estimate and calculate the coefficient of thermal expansion CTE using the thermomechanical analysis method
• Using the information of thermomechanical analysis to predict warpage of a part printed with PA12 powder
• The curling effect on Powder Bed Fusion