25.02.2025 by Aileen Sammler

Kinetic Analysis of Storage Modulus Using the NETZSCH DMA 303 Eplexor®

Understanding the Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing behavior of resin systems is essential for advancing materials research across industries such as additive manufacturing, inks and coatings for automotive and EE applications. This article explores how dynamic mechanical analysis using the DMA 303 Eplexor® and the Kinetics Neo Software provides precise capabilities that enable researchers to effectively predict and optimize resin Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing processes.

The Application: UV-Cured Resin Systems

UV-cured resin systems rely on Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.crosslinking reactions to form robust three-dimensional networks, which impart vital material properties such as hardness, elasticity, and chemical resistance. Optimal Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing requires a balance of UV and thermal post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing to fine-tune these properties.

Dynamic Mechanical Analysis (DMA) is instrumental in studying processes like post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing. By analyzing the storage modulus—ameasure of stiffness—researchers can predict how materials behave under different conditions. This study used the NETZSCH DMA 303 Eplexor®, which stands out for its accuracy and versatility in mechanical and thermal analysis.

The following application note offers insights into these subjects:

Read our latest Application Note!

For detailed measurement methods and findings, download the full application note "Kinetic Analysis of the Storage Modulus to Predict the Thermal Post-Curing of a UV-Cured Resin System":

NETZSCH DMA 303 Eplexor®:A Trusted Standard

The DMA 303 Eplexor® provides:

  • Application of Precise Forces up to 50 N Dynamic and Static
  • Wide Temperature Range from -170°C to 800°C
  • Frequency Range of 0.001 Hz to 150 Hz
  • Highest Sensitivity with 1-nm Resolution
  • Accessories for Multiple Measuring Modes (3-point bending, compression, penetration, cantilever, shear) and a Variety of Sample Holders

The Kinetics Neo Software: A Game-Changer for Prediction

The DMA 303 Eplexor® can be complemented by the Kinetics Neo software, which enhances its analytical power through:

  • Optimized Curing Cycles: Measurements showed that temperatures of 200°C and 210°C resulted in significant stiffness increases without causing material damage, as observed at 220°C.
  • Predictive Modeling: Models material behavior under untested conditions with high accuracy (R² = 0.995).
  • Efficiency Gains: Reduces the need for extensive experimental trials, saving time and costs.

The DMA 303 Eplexor®, paired with the Kinetics Neo software, delivers the precision and flexibility needed to advance materials research.

Learn more about NETZSCH DMAs

  • DMA 303 Eplexor®
    • Wide temperature range from -170°C to 800°C
    • Precise forces up to 50 N dynamic and static
    • Accessories for multiple measuring modes and a variety of sample holders
  • DMA 523 Eplexor®
    • Temperature range from -160°C to 500°C
    • Dynamic forces up to ±4000N
    • Static forces up to 6000N
  • DMA 503 Eplexor®
    • Temperature range from -160°C to 500°C
    • Dynamic forces up to ±500N
    • Static forces up to 1500N