
25.02.2025 by Aileen Sammler
Kinetic Analysis of Storage Modulus Using the NETZSCH DMA 303 Eplexor®
Understanding the Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing behavior of resin systems is essential for advancing materials research across industries such as additive manufacturing, inks and coatings for automotive and EE applications. This article explores how dynamic mechanical analysis using the DMA 303 Eplexor® and the Kinetics Neo Software provides precise capabilities that enable researchers to effectively predict and optimize resin Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing processes.
The Application: UV-Cured Resin Systems
UV-cured resin systems rely on Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.crosslinking reactions to form robust three-dimensional networks, which impart vital material properties such as hardness, elasticity, and chemical resistance. Optimal Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing requires a balance of UV and thermal post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing to fine-tune these properties.
Dynamic Mechanical Analysis (DMA) is instrumental in studying processes like post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing. By analyzing the storage modulus—ameasure of stiffness—researchers can predict how materials behave under different conditions. This study used the NETZSCH DMA 303 Eplexor®, which stands out for its accuracy and versatility in mechanical and thermal analysis.
The following application note offers insights into these subjects:
- Understanding Curing Kinetics – The kinetic analysis of the storage modulus provides critical insights into the Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing behavior of a UV-cured resin system, enabling precise predictions of thermal post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing effects.
- Optimization of Curing Cycles – By utilizing the Kinetics Neo software, the optimal post-Curing (Crosslinking Reactions)Literally translated, the term “crosslinking“ means “cross networking”. In the chemical context, it is used for reactions in which molecules are linked together by introducing covalent bonds and forming three-dimensional networks.curing temperature and time can be determined to achieve the desired material properties efficiently.
- Reduction of Experimental Costs – The methodology minimizes the need for extensive physical experiments by simulating various curing scenarios, saving both time and costs.
- Material Adaptation for Different Applications – The kinetic model supports customization of the curing process to meet industry-specific needs, whether requiring more flexible or rigid materials.
- Insights into Thermal Material Stability – The results highlight that excessive temperatures (>220°C) can lead to embrittlement, helping establish safe and effective post-curing conditions.

Read our latest Application Note!
For detailed measurement methods and findings, download the full application note "Kinetic Analysis of the Storage Modulus to Predict the Thermal Post-Curing of a UV-Cured Resin System":
NETZSCH DMA 303 Eplexor®:A Trusted Standard
The DMA 303 Eplexor® provides:
- Application of Precise Forces up to 50 N Dynamic and Static
- Wide Temperature Range from -170°C to 800°C
- Frequency Range of 0.001 Hz to 150 Hz
- Highest Sensitivity with 1-nm Resolution
- Accessories for Multiple Measuring Modes (3-point bending, compression, penetration, cantilever, shear) and a Variety of Sample Holders

The Kinetics Neo Software: A Game-Changer for Prediction
The DMA 303 Eplexor® can be complemented by the Kinetics Neo software, which enhances its analytical power through:
- Optimized Curing Cycles: Measurements showed that temperatures of 200°C and 210°C resulted in significant stiffness increases without causing material damage, as observed at 220°C.
- Predictive Modeling: Models material behavior under untested conditions with high accuracy (R² = 0.995).
- Efficiency Gains: Reduces the need for extensive experimental trials, saving time and costs.
The DMA 303 Eplexor®, paired with the Kinetics Neo software, delivers the precision and flexibility needed to advance materials research.